AboutComponents, Circuits, Devices and Systems
Keywords:Advanced Packaging, Materials for Interconnects and Packaging,Optoelectronic Systems Packaging,Assembly and Manufacturing Technologies,Design Tools and Modeling,Power Electronics System Packaging,Advanced Technologies for Emerging Systems,Reliability of Electronic Devices and Systems,Flexible Printed and Hybrid Electronics,RF mm-wave and THz Systems Packaging,Global Education for Electronics,
Scope:This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.
Sponsor Type:1
Call for paper

Important date

1970-01-01 00:00:00
Abstract submission deadline
1970-01-01 00:00:00
Abstract notification of acceptance
1970-01-01 00:00:00
Draft paper submission deadline
1970-01-01 00:00:00
Draft paper acceptance notification
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Important Date
  • Conference Date

    Sep 11



    Sep 13


  • Sep 13 2024

    Registration deadline

Sponsored By
IEEE Electronics Packaging Society