IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia 2018)

199 / 2017-11-14 07:43:58

A Double-sided Cooling 1200V/600A Multichip Half-bridge IGBT Module Using Nano-silver Paste as Die-attaching Material

Sinter,Double-sided cooling,high density,high temperautre,nanosilver

A double-sided cooling 1200V/600A multichip half-bridge IGBT module is successfully fabricated by utilizing nano-silver paste as die-attaching material. Excellent thermal performance is one of the prominent advantages of the module since the this packaging structure can realize double-sided cooling and sintered Ag has a higher thermal conductivity compared with traditional solders. Electrical performance can also be improved due to the reduction of parasitic inductance. Power cycling test is conducted to determine the module’ s reliability, the test results show the module has a long power cycling life, i.e., excellent reliability.