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222 / 2017-11-21 19:30:54
Thermo-Mechanical Analysis of SiC Schottky-Barrier Diode Press Pack Packaging using Finite Element Simulation
SiC,SBD,Finite Element Method (FEM),press pack packaging,HVDC,smart grid
Plenary track > Packaging, power modules, and ICs
Final Paper
Ke Feng / CRRC Yongji Electric Co. Ltd.
Xiaofei Yang / CRRC Yongji Electric Co. Ltd.
Zhao Wang / CRRC Yongji Electric Co. Ltd.
Important Date

  • Conference Date

    May 17

    2018

    to

    May 19

    2018

  • Dec 08 2017

    Abstract Submission Deadline

  • Jan 30 2018

    Abstract Notification of Acceptance

  • Feb 10 2018

    Draft paper submission deadline

  • Feb 10 2018

    Final Paper Deadline

  • May 19 2018

    Registration deadline

Sponsored By
IEEE
Organized By
Xi'an Jiaotong University
Xidian University
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