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261 / 2017-11-23 00:54:36
Novel Silicon Carbide Integrated Power Module for EV application
Plenary track > Packaging, power modules, and ICs
Final Paper
Bassem Mouawad / University of Nottingham
Jordi Espina / University of Nottingham
Jianfeng Li / University of Nottingham
Lee Empringham / University of Nottingham
christopher Johnson / University of Nottingham
Important Date

  • Conference Date

    May 17

    2018

    to

    May 19

    2018

  • Dec 08 2017

    Abstract Submission Deadline

  • Jan 30 2018

    Abstract Notification of Acceptance

  • Feb 10 2018

    Draft paper submission deadline

  • Feb 10 2018

    Final Paper Deadline

  • May 19 2018

    Registration deadline

Sponsored By
IEEE
Organized By
Xi'an Jiaotong University
Xidian University
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