IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia 2018)

289 / 2017-12-07 16:23:22

A Novel Packaging Method Using Flexible Printed Circuit Board for High-Frequency SiC Power Module

Module,silicon carbide,wide bandgap,packaging

Plenary track > Packaging, power modules, and ICs

In this paper, a novel packaging method that features wirebond-less structure based on sintering by using flexible printed circuit board (FPCB) are presented. Detailed comparisons are also conducted with an improved hybrid packaging. As the contrast, the results reveal the better performances of the novel packaging method in smaller parasitic inductances, less switching losses, better thermal stability and reliability. In addition, this paper presents the analysis on the reliability of the novel packaging structure to verify feasibility. Finally, the high-frequency SiC power module using the novel packaging method was built and tested. As a result, the novel packaging structure using FPCB has smaller parasitic inductance, better thermal performance and reliability. Experiment results will be exhibited later to sufficiently validate the feasibility of the proposed FPBC structure.