The 15th IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)

553 / 2019-03-14 20:04:47

Study on thermal conductivity of aluminum-based micro-arc oxidation film for high-power LED

aluminum-based substrate, micro-arc oxidation film ，equivalent heat dissipation model，COMSOL

Plenary track > Optoelectronic Materials and Devices

The problem of heat dissipation is the bottleneck of LED packaging industry which needs to be solved urgently. In this paper, micro-arc oxidation treatment was carried out on the surface of aluminum substrate for LED packaging, and the junction temperature produced by LED was derived efficiently by this thin layer. The thermal conductivity of ordinary PCB substrate, 96 ceramic substrate and aluminum-based micro-arc oxide substrate were compared by using 5W ceramic heating plate as simulation heat source.The results show that the bonding temperature of the simulated parts is 30.8℃ and the overall thermal resistance of the heat dissipation module is only 1.58℃/ W using the aluminum-based micro-arc oxide film substrate, and the micro-arc oxidation film aluminum-based substrate has better thermal conductivity.