The 15th IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)

Dear EDSSC authors,

We are very pleased to announce that nearly 300 papers have been accepted for publication at EDSSC2019. The committee really appreciates your support to the conference!

The final paper and publication agreement should be uploaded or signed by April 10. It is suggested that you revise the technical content according to the reviewer’s comments if they are included in the submission system.

Please prepare your papers strictly according to the new template, in which the format of author’s information is simplified. We have highlighted 7 common mistakes in the drafts and an instruction is also included. The new template and the instruction can be downloaded by clicking on the following links:

http://file.aconf.org/conf/hz/2018/05/159665//20190401184351.doc

http://file.aconf.org/conf/hz/2018/05/159665//files/20190401184254.doc

Please note that the final paper should be converted (if you upload word file) or checked (if you upload pdf file) again by using IEEE PDF eXpress https://www.pdf-express.org/. And please upload the converted or checked pdf version paper to the conference website (use “Re-upload paper” button).(The conference ID is 45723X.  )

Publication agreement link has been repaired. Please sign it using the button next to the “Re-upload paper” in the conference website’s submission system. If you have successfully signed it please ignore this message.

Lastly, if you strongly wish to change your presentation type, please contact us by sending emails to edssc2019@126.com.

Thanks for your cooperation !

Looking forward to seeing you in Xi’an soon !

Best regards

EDSSC2019 Committee