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197 / 2019-05-05 10:10:44
3D Defect Quantification Based on Chirp Excitation and High-resolution EC-TMR Sensor
Plenary track
Abstract Accepted
Important Date

  • Conference Date

    Sep 11

    2019

    to

    Sep 14

    2019

  • Sep 14 2019

    Registration deadline

  • Nov 30 2019

    Draft paper submission deadline

Sponsored By
University of Electronic Science and Technology of China
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