Comparing Hexagonal and Circular Cell Designs for SiC MPS Diode: The Curvature Effect on Avalanche Capability
ID:103 View Protection:ATTENDEE Updated Time:2021-07-21 20:06:12 Hits:1624 Oral Presentation

Start Time:2021-08-27 08:30(Asia/Shanghai)

Duration:15min

Session:Room2 Oral Session 2 » S5&S6WBG Device Design and Gate Drivers

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Abstract
In this work, the SiC MPS diodes with hexagonal and circular cell designs are studied and compared regarding the static performance and avalanche capability via experiment and 3D TCAD simulation. The experimental results exhibit that the breakdown voltage of the MPS-B diode (circular cell) is slightly higher than that of the MPS-A diode (hexagonal cell). The Unclamped-Inductive-Switching (UIS) tests are also performed for the two devices, and the MPS-B diode has a better avalanche capability both in terms of avalanche energy/ current capabilities. Simultaneously, the MPS-A diode shows a higher increase rate and higher maximum voltage (Vd_max) during the avalanche pulse, meaning a higher junction temperature rise (ΔTj) and a reduced avalanche capability. The simulation results reveal the electric field of the corners of hexagonal P+ islands is higher than that of the edges of circular P+ islands due to the curvature effect, which leading to a more serious heat crowding and a premature failure. This phenomenon illustrates a smoother design (such as the circular cell design) should be used to replace the corner area and to alleviate the electric field crowding issue, which helps to enhance the avalanche robustness of the SiC device.
Keywords
SiC,MPS Diode,Curvature Effect,Avalanche Capability,Cell Design
Speaker
Li Liu
Zhejiang University

Submission Author
Li Liu Zhejiang University
Na Ren Zhejiang University
Jiupeng Wu Zhejiang University
Zhengyun Zhu Zhejiang University
Hongyi Xu Zhejiang University
Qing Guo 浙江大学
Kuang Sheng Zhejiang University
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Important Date
  • Conference Date

    Aug 25

    2021

    to

    Aug 27

    2021

  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

  • Aug 27 2021

    Registration deadline

Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology