Effects of p-type Islands Configuration on the Electrical Characteristics of the 4H-SiC Trench MOSFETs with Integrated Schottky Barrier Diode
ID:112 View Protection:PUBLIC Updated Time:2021-08-23 23:51:36 Hits:1342 Poster Presentation

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Abstract
The p-type islands embedded into the drift layer were found effective in shielding the contacts and reducing the leakage current even at high temperature. Two types of SBD-integrated trench gate MOSFETs with p-type buried-layer (BLSI-MOS), are proposed by numerical simulation using SENTAURUS TCAD. Even though the BLSI-MOS has embedded SBD, the active area of MOSFET is not consumed due to the effect of buried grid. Thus, they demonstrate the advantage of specific on-resistance (Ron,sp) reduction over the developed double-trench MOSFET without SBD. However, the position of the buried-layer (BL) with respect to the contacts has an influence on the electrical properties of MOSFET and SBD. Meanwhile, the BL is short to source contacts or floating so as to justify the connection's effects on the dynamic characteristics. These results will provide guidance for design and modeling of 4H-SiC SBD-integrated trench MOSFET.
 
Keywords
Silicon Carbide,trench MOSFET,schottky barrier diode,electric field,short-circuit,high temperature
Speaker
Zhanwei Shen
Chinese Academy of Sciences;Institute of Semiconductors

Zhanwei Shen received his B.S. degree from Xidian University, Xi’an, China, in 2012, and the Ph.D. degree from Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China, in 2017. He is currently an Assistant Professor with Institute of Semiconductors, Chinese Academy of Sciences. His research and development activities include SiC-based power device design, gate-oxide growth and characterization, and relevant device fabrication.

Submission Author
Fei Yang State Key Laboratory of Advanced Power Transmission Technology Global Energy Interconnection Research Institute Co., Ltd.
Lixin Tian State Key Laboratory of Advanced Power Transmission Technology, Global Energy Interconnection Research Institute Co., Ltd.
Zhanwei Shen Chinese Academy of Sciences;Institute of Semiconductors
Guoguo Yan Chinese Academy of Sciences;Institute of Semiconductors
Xingfang Liu Chinese Academy of Sciences;Institute of Semiconductors
Wanshun Zhao Institute of Semiconductors, Chinese Academy of Sciences
Lei Wang Institute of Semiconductors, Chinese Academy of Sciences
Guosheng Sun Chinese Academy of Sciences;Institute of Semiconductors
Junmin Wu State Key Laboratory of Advanced Power Transmission Technology Global Energy Interconnection Research Institute Co., Ltd.
Feng Zhang Department of Physics, Xiamen University
Yiping Zeng Chinese Academy of Sciences;Institute of Semiconductors
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Important Date
  • Conference Date

    Aug 25

    2021

    to

    Aug 27

    2021

  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

  • Aug 27 2021

    Registration deadline

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IEEE
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology