Design of a High Power Density Bidirectional AC/DC Converter Based on GaN
ID:22 View Protection:PUBLIC Updated Time:2021-08-20 20:48:46 Hits:1420 Poster Presentation

Start Time:2021-08-27 12:45(Asia/Shanghai)

Duration:1min

Session:P Poster » P1Poster 1

Abstract
Traditional Si-based semiconductors have a large reverse recovery charge, which brings great challenges to the application of totem-pole bridgeless PFC. With the rise of the third-generation semiconductor device SiC/GaN, totem-pole bridgeless PFC has gradually attracted people's attention. This paper designs a high-power density, high-efficiency bidirectional AC/DC converter based on GaN HEMTs. When working in the forward direction, the totem-pole bridgeless PFC is connected to a synchronous Buck to realize 220V@AC input, and 300V to 400V@DC 1A constant current output; When working in the reverse direction, Boost is connected to a unipolar inverter to achieve 300V to 400V@DC input, 220V 1.5A@AC output, and the output frequency and phase can follow the reference sinusoidal signal. The converter can realize 400W power conversion, with a peak efficiency of 97.2% and power density of 85W/inch3.
Keywords
Totem-pole bridgeless PFC,GaN,High power density
Speaker
Jiajia Guan
Huazhong University of Science and Technology

Submission Author
Jiajia Guan Huazhong University of Science and Technology
Zhiwei Wang Huazhong University of Science and Technology
Ziyan Tang Huazhong University of Science and Technology
Jianwei Lv Huazhong University of Science and Technology
Cai Chen Huazhong University of Science and Technology;State Key Laboratory of Advanced Electromagnetic Engineering and Technology
Yong Kang Huazhong University of Science and Technology;School of Electrical and Electronic Engineering
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Important Date
  • Conference Date

    Aug 25

    2021

    to

    Aug 27

    2021

  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

  • Aug 27 2021

    Registration deadline

Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology