An Integrated GaN-Based Power Module Based on the Cooling-System-Inductor Structure
ID:42 View Protection:PUBLIC Updated Time:2021-07-21 20:02:16 Hits:1368 Poster Presentation

Start Time:2021-08-27 12:26(Asia/Shanghai)

Duration:1min

Session:P Poster » P1Poster 1

Abstract
The emerging gallium nitride-based (GaN) semiconductor device due to lower switching loss and smaller package size enables multi-phase point-of-load (POL) converters toward higher power density and efficiency in data centers. This paper presents an integrated GaN-based power module with high power density and high efficiency, which is based on active integration and passive integration techniques. The integrated GaN-based power module not only can achieve lower parasitic parameters, but also can achieve efficient cooling capability employing a multifunctional integrated magnetic component. The component plays an important roles of both the integrating four filter inductors and heat sink of the integrated power module. A 150 W, 12-1.8 V, simulation and experimental prototype of the integrated power module is designed. The simulation results demonstrate that the integrated power module has lower parasitic parameters, and good themal performance.
 
Keywords
inductor,GaN
Speaker
Longyang Yu
Xi'an Jiaotong University

Submission Author
Longyang Yu Xi'an Jiaotong University
Wei Mu Xi'an Jiaotong University
Huaqing Li Xi'an Jiaotong University
Yang ChengZi Xi’an Jiaotong University
Chenya Wang Xi'an Jiaotong University
Laili Wang Xi'an Jiaotong University
Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    Aug 25

    2021

    to

    Aug 27

    2021

  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

  • Aug 27 2021

    Registration deadline

Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology