Design, Fabrication and Characterization of 6.5 kV/100A 4H-SiC PiN Rectifier
ID:44 View Protection:PUBLIC Updated Time:2021-07-21 20:02:17 Hits:1368 Poster Presentation

Start Time:2021-08-27 12:24(Asia/Shanghai)

Duration:1min

Session:P Poster » P1Poster 1

Abstract
A high-voltage 6.5kV/100A 4H-SiC PiN rectifier with multiple-ring modulated junction termination extension (MRM-JTE) is designed, fabricated and characterized in this paper. The MRM-JTE expands the JTE implantation dose window and increases the breakdown voltage in comparison with the traditional two-zone JTE (TZ-JTE) without an additional process steps and the number of masks. The design and optimization for the proposed devices are performed using two-dimensional numerical simulation tool TCAD Silvaco. A measured breakdown voltage of SiC PiN is up to 7.4kV corresponding to 91% of the ideal parallel plane junction. The forward voltage drop for the fabricated device with the active area of chip of 4.6×4.6mm2 is 3.8V at 100A forward current, and the differential specific on-resistance (RON,SP) is 2.5Ωm·cm2 at 100A/cm2 forward current density. In addition, the dynamic reverse recovery time is 166ns and softness factor is 1.23 at room temperature. The wide implantation dose window and high terminal efficiency show that the fabricated 4H-SiC PiN rectifier has an improve effect on the junction curvature effect, which is of great significance for the further fabrication of high-voltage and high-power SiC modules.
Keywords
SiC PiN rectifier,MRM-JTE,high voltage,specific on-resistance,reverse recovery
Speaker
Mengling Tao
University of Electronic Science and Technology of China

Submission Author
Mengling Tao University of Electronic Science and Technology of China
Xiaochuan Deng University of Electronic Science and Technology of China
Rui Hu University of Electronic Science and Technology of China
Xuan Li University of Electronic Science and Technology of China
Zhiqiang Li China Academy of Engineering Physics
Hongling Lu China Aerospace Science and Technology Corporation
Yi Wen University of Electronic Science and Technology of China
Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    Aug 25

    2021

    to

    Aug 27

    2021

  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

  • Aug 27 2021

    Registration deadline

Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology