Automated SiC MOSFET Power Module Switching Characterization Test Platform
ID:47 View Protection:PUBLIC Updated Time:2021-08-20 17:55:22 Hits:1449 Poster Presentation

Start Time:2021-08-27 12:21(Asia/Shanghai)

Duration:1min

Session:P Poster » P1Poster 1

Abstract
To address the problems of large test error and low efficiency in switching characterization test of wide-bandgap (WBG) power semiconductor devices, an automated high accuracy switching performance test platform for SiC MOSFET power module is proposed. This paper focuses on optimizing the design of hardware and software which can efficiently, accurately and safely obtain switching characteristics parameters of SiC MOSFET power module by double pulse test (DPT), as well as short-circuit test and body diode reverse recovery test to acquire more comprehensive switching behaviors of the devices under test (DUT). Real-time test results can be achieved. The multi-process test is serial, and the test data can be compared and managed using a database system. The design principles are experimentally verified by testing the Cree 1.2kV SiC MOSFET power module.
Keywords
Switching Characterization,SiC MOSFETs Modules,Automated Test Platform,Double Pulse Test
Speaker
Shuhao Yang
Fudan University

Submission Author
Shuhao Yang Fudan University
Saijun Mao Fudan University
Zhikun Wang Fudan University
Xi Lu UniSiC Technology (Shanghai) Co., Ltd.
Jun Chen UniSiC Technology (Shanghai) Co., Ltd.
Hansen Chen UniSiC Technology (Shanghai) Co., Ltd.
Keqiu Zeng Philips Healthcare (Suzhou) Co.,Ltd.
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Important Date
  • Conference Date

    Aug 25

    2021

    to

    Aug 27

    2021

  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

  • Aug 27 2021

    Registration deadline

Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology