Research on A Novel Parallel Resonant DC Link Soft-switching Inverter Based on SiC MOSFET
ID:54 View Protection:PUBLIC Updated Time:2021-07-21 20:02:23 Hits:1309 Poster Presentation

Start Time:2021-08-27 12:14(Asia/Shanghai)

Duration:1min

Session:P Poster » P1Poster 1

Abstract
In order to realize a silicon carbide (SiC) MOSFET soft-switching inverter with high efficiency, low voltage stress and convenient control, a novel parallel resonant DC link soft-switching inverter is proposed in this paper. It can realize zero-voltage turn-on/off of main switch in the inverter bridge and zero-voltage/current turn-on/off of auxiliary switch in the auxiliary circuit, and it is convenient to control without setting inductor current threshold. At the same time, it avoids using coupled inductor and split capacitor which reduce power density, and the latter will also bring neutral point potential drift. The control of soft-switching inverter is simple and independent of load conditions, and the required time of transition process can be freely selected. In this paper, under the proposed modulation strategy, according to the equivalent circuit in the different work modes, the operation principle, soft-switching realization conditions and parameter design methods of the inverter are analyzed. At last, a 5kW prototype is made by using SiC MOSFET as switching device, and the effectiveness of the inverter is verified by experiments.
Keywords
SiC MOSFET,soft-switching,zero-current,zero-voltage,parallel resonant DC link inverter
Speaker
Si Li
doctoral candidate Harbin Institute of Technology

Submission Author
Si Li Harbin Institute of Technology
Ming Yang Harbin Institute of Technology
Yu Ma Harbin Institute of Technology
Dianguo Xu Harbin Institute of Technology
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Important Date
  • Conference Date

    Aug 25

    2021

    to

    Aug 27

    2021

  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

  • Aug 27 2021

    Registration deadline

Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology