IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WIPDA-ASIA 2021)

The lack of the methodology to characterize the electro-thermo-mechanical interaction mechanism in SiC power module has brought great challenges to the multi-physics co-simulation of the power module.  In this article, an automated multi-physical fields modeling and co-simulation methodology based on PSpice-MATLAB-COMSOL is proposed for SiC power module design. Firstly, the multi-physical fields coupling mechanism and basic co-simulation principle of the proposed methodology are described. Then, the co-simulation software interface and indirect coupling strategy are designed for this methodology, which can reflect the evolution of various physical fields of SiC power module from initial condition to steady state through continuous transient simulation. Finally, the proposed co-simulation methodology is verified by direct steady-state thermal simulation of a self-designed SiC MOSFET power module. A SiC MOSFET power module based Buck converter is also under development to further validate the accuracy of the the proposed simulation methodology.

Electro-Thermal-Mechanical,SiC Power Module,Co-Simulation