Start Time:2021-08-27 09:15(Asia/Shanghai)
Duration:15min
Session:Room2 Oral Session 2 »
No files
In this work, a novel GaN MIS-HEMT with highly suppressed short-channel effect is proposed and investigated. The device features a Source-connected clamp electrode near to the Drain-side Gate edge, which can clamp the voltage at the Drain-side Gate edge to less than 2V, subsequently suppressing the short-channel effect. Compared with the conventional short-channel GaN MIS-HEMT, the off-state leakage current of the proposed GaN MIS-HEMT decreases from 10-1 A/mm to 10-7 A/mm (with Gate voltage of 0V and Drain voltage of 10V), and the electron density under the Gate region is also greatly reduced (from 1018 cm-3 to 1011 cm-3), subsequently increasing the threshold voltage from the negative value to 2V. Moreover, the proposed GaN MIS-HEMT also delivers much lower reverse Gate-to-Drain capacitor due to the electrostatic shielding of the Source-connected clamp electrode. Both increase in the length and depth of the Source-connected Schottky clamp electrode can further reduce the off-state leakage current, the electron density under the Gate region, and the reverse Gate-to-Drain capacitor. The excellent characteristics of the proposed SC GaN MIS-HEMT show that the device is promising for future power applications.
Aug 25
2021
Aug 27
2021
Abstract Submission Deadline
Abstract Notification of Acceptance
Final Paper Deadline
Contribution Submission Deadline
Registration deadline
2025-08-15 China Beijing
2025 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia2025-08-15 China Beijing
The 2025 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia2023-08-27 Taiwan, China Hsinchu
2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia2018-05-17 China xian
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Submit Comment