Analysis of an Output Series High Voltage Gain Impedance Source Circuit Based on SiC Switch
ID:90 View Protection:ATTENDEE Updated Time:2021-08-20 16:45:45 Hits:1603 Oral Presentation

Start Time:2021-08-27 14:15(Asia/Shanghai)

Duration:15min

Session:Room1 Oral Session 1 » S3&S4WBG Device Applications, Package Design & Analysis

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Abstract
In order to further improve the voltage gain of the traditional Y-source inverter, a series output type high-gain impedance source inverter topology is proposed. The topology is a two-stage circuit. The front-stage circuit is composed of two symmetrically designed switches in front of an improved Y-source DC-DC topology, which optimizes the switch stress and expands the duty cycle adjustment range; the second-stage circuit is full Bridge inverter circuit. Through the symmetrical design of the pre-stage circuit, a higher DC bus voltage is obtained by connecting the outputs in series. To further improve the power density, the planar magnetic components and SiC switches are adopted. Establish a theoretical model of planar inductance, analyze the advantages and disadvantages of different winding arrangements, and determine the inductance parameters with the help of finite element simulation software. In order to verify the theoretical analysis, an experimental platform is built, and a Y-source coupled planar inductor is designed and manufactured. The experimental results show that: under the rated power, the boost ratio can reach 5, which effectively improves the voltage gain.
Keywords
output series,planar inductance,winding optimization,Y-source converter
Speaker
Qing Cheng
China;School of Electrical Engineering and Automation; Harbin Institute of Technology; Harbin

Submission Author
Qing Cheng China;School of Electrical Engineering and Automation; Harbin Institute of Technology; Harbin
Wei Wang Harbin Institute of Technology
Yueshi Guan Harbin Institute of Technology
Tingting Yao Harbin Institute of Technology
Dianguo Xu Harbin Institute of Technology
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Important Date
  • Conference Date

    Aug 25

    2021

    to

    Aug 27

    2021

  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

  • Aug 27 2021

    Registration deadline

Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology