Start Time:2021-08-27 15:45(Asia/Shanghai)
Duration:15min
Session:Room1 Oral Session 1 »
No files
This paper describes an automatic optimization method for multi-chip power module (MCPM) layout based on template generation and evolutionary computation techniques. The method is developed with particular emphasis on reducing the commutation inductance and balancing the branch inductances among paralleled chips of the module. An automatic layout generation from netlist and design constraints to ready-to-fabricate prototype is carried using two-step graph-based template generation and genetic algorithm-based sizing approach. The method employs the built-in multi-port discrete circuit model for fast evaluation of layout inductance for parasitics extraction. An analytical model is also established to assist the design of embedded snubber in the post-process stage. The layout design of a 4-chip SiC module is demonstrated. Both the simulations and the experiments are conducted to illustrate the advantage of performing the automatic optimization from the initial stage of the design process.
Aug 25
2021
Aug 27
2021
Abstract Submission Deadline
Abstract Notification of Acceptance
Final Paper Deadline
Contribution Submission Deadline
Registration deadline
2025-08-15 China Beijing
2025 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia2025-08-15 China Beijing
The 2025 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia2023-08-27 Taiwan, China Hsinchu
2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia2018-05-17 China xian
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Submit Comment