Power Loop Inductance Extraction with High Order Polynomial Fitting Algorithm for SiC MOSFET Power Module Characterization
ID:98 View Protection:ATTENDEE Updated Time:2021-07-21 20:06:09 Hits:1606 Oral Presentation

Start Time:2021-08-27 16:45(Asia/Shanghai)

Duration:15min

Session:Room1 Oral Session 1 » S3&S4WBG Device Applications, Package Design & Analysis

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Abstract
An accurate method for extracting the power loop parasitic inductance with high order polynomial fitting algorithm is proposed for the SiC MOSFET power module characterization. The power loop inductance distribution of the SiC MOSFET power module double pulse test platform is illustrated. The stray inductance is characterized using 5 sorts of approaches with integral method, differential method, least squares fitting method, sliding mean filtering algorithm and high order polynomial fitting algorithm at 400V/150A-570A. The experimental results using the existing 4 methods show relative errors more than 21.09nH from 8.17nH to 48.53nH compared to the tested inductance by impedance analyzer. Extracting inductance using high order polynomial fitting algorithm ranges from 30.42nH to 32.54nH at both low and high cureent, and the deviation is from 3.34nH to 5.50nH. Considering the inductance of the probe, the module contact terminal and the bus capacitor, the calculated results are consistent with the test result of 27.20nH. The parasitic inductance of 28.21nH simulated by ANSYS Q3D validates the accuracy of the proposed method. The fitted lines with the calculated stray inductance and di/dt match with the drain-to-source voltage of SiC MOSFET power module at both turn-on and turn-off transient.
 
Keywords
Power Loop Inductance,SiC MOSFETs Modules,High Order Polynomial Fitting Algorithm,Switching Characterization
Speaker
Zhikun Wang
Fudan University

Submission Author
Zhikun Wang Fudan University
Saijun Mao Fudan University
Shuhao Yang Fudan University
Wenyu Li Fudan University
Ding Yujie Fudan University
Xi Lu UniSiC Technology (Shanghai) Co., Ltd.
Jun Chen UniSiC Technology (Shanghai) Co., Ltd.
Keqiu Zeng Philips Healthcare (Suzhou) Co., Ltd.
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Important Date
  • Conference Date

    Aug 25

    2021

    to

    Aug 27

    2021

  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

  • Aug 27 2021

    Registration deadline

Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology