24 / 2021-03-19 17:41:46
Parametric study on the low-frequency sound absorption performance of a double-layer multiple parallel-arranged inhomogeneous microperforated panel absorber
Sound Absorption,low-frequency noise,Microperforated panel absorbers,Acoustics,Liquid crystal display,3D printing,Impedance Tube
Draft Accepted
Faisal Rafique / Xi'an Jiaotong University
Jiu Hui Wu / Xi'an Jiaotong University
A microperforated panel (MPP) absorber has been presented as a substitute to traditional and common conventional (Fibrous and Porous) sound-absorbing materials due to their low energy dissipation and poor absorption performance for low-frequency sound. This paper examines parametric study on the low-frequency sound absorption and wider absorption bandwidth characteristics of a double-layer multiple parallel-arranged inhomogeneous microperforated panel (DL-iMPP) absorber. The theoretical formula for calculating the absorption coefficient under normal incident sound is established based on an electrical equivalent circuit model (ECM). Theoretical and parametric study based on ECM is performed on the MATLAB software, and the predicted results are obtained. The results show that by varying and adjusting thickness, perforation size, perforation ratio, width and height of back-cavity depths, the proposed model can produce wider absorption bandwidth of 175 Hz-430 Hz in the low-frequency region with a decent average absorption coefficient of more than 80% (α = 0.83) compared to the existing studies. In addition, by increasing the depth of the cavity behind a sub-MPP with large diameter holes and a small perforation ratio, the bandwidth can be improved to a lower frequency. Samples were made using Liquid Crystal Display (LCD) technology for the experimental validation. The MATLAB simulation based predicted results are validated through square impedance tube-based experiments.
Important Date
  • Conference Date

    Nov 01

    2022

    to

    Nov 03

    2022

  • Oct 30 2022

    Draft paper submission deadline

  • Nov 09 2022

    Registration deadline

Sponsored By
Qingdao University of Technology