Simulation of Interpolated Heat Dissipation Structures Using Fins and Water-cooling for Solid Medium Frequency Transformer
ID:555 View Protection:ATTENDEE Updated Time:2022-05-22 09:40:39 Hits:407 Poster Presentation

Start Time:Pending(Asia/Shanghai)

Duration:Pending

Session:No Session »

Video No Permission Presentation File

Tips: Only the registered participant can access the file. Please sign in first.

Abstract
Medium/high-frequency transformer (MFT/HFT) is an essential device in solid-state transformer (SST), connecting the medium and low voltages for flexible power distribution network application. Tremendous heating generated by significant power loss in MFT is one of the key issues for high voltage and high power SST operation. This paper focuses on the influence of heat dissipation structures on the temperature rise in a 10kW/10kHz MFT used for a 10 kV SST prototype. A newly interpolated structure using an aluminum sheet with fins or a water-cooling panel was proposed. Power losses from the core, windings, and insulation were calculated using finite element method simulation by considering high frequency and harmonics. After that, the thermal heating, combined with the fluid dynamics was simulated to obtain the temperature distribution in the MFT. It pointed out that the temperature is reduced by 25℃ by interpolating the aluminum sheet with fins, especially for the forced air-cooling. Water cooling structure exhibits a better effect for decreasing the temperature rise. An enhancement of heat conduction near the water entrance is ascribed to the temperature gradient and the vortex effect. It can be concluded that the interpolated aluminum sheet with fins presents great potential application due to its simplicity.
Keywords
MFT; heat dissipation structure; power loss; hot spot temperature; heat flux.
Speaker
DiqinMa
西安交通大学

Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    May 27

    2022

    to

    May 29

    2022

  • Feb 28 2022

    Draft paper submission deadline

  • May 29 2022

    Registration deadline

  • Jun 22 2022

    Contribution Submission Deadline

Sponsored By
IEEE Beijing Section
China Electrotechnical Society
Southeast University
Supported By
IEEE Industry Applications Society
IEEE Nanjing Section
Contact Information