Effect of Crystal Morphology on Breakdown Properties of XLPE at Mesoscale
ID:251 View Protection:ATTENDEE Updated Time:2022-09-11 23:42:47 Hits:283 Poster Presentation

Start Time:Pending(Asia/Shanghai)

Duration:Pending

Session:No Session »

Presentation File

Tips: Only the registered participant can access the file. Please sign in first.

Abstract
As a polymer material with a semi-crystalline structure, the macroscopic insulation breakdown properties of cross-linked polyethylene (XLPE) insulation materials under the action of electric fields are closely related to their crystal morphology at the mesoscopic scale. In order to study the effect of crystallization morphology of XLPE material on AC breakdown strength and analyze its mechanism of action, four different ways were used in this paper to control the cooling rate of the material during the crystallization process, and XLPE materials with different crystallization morphologies were prepared and obtained. The crystal morphology of the material was also characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD), and its insulation properties were tested using a broadband dielectric spectrometer, DC conductivity, and AC breakdown platform. The experimental results show that the reduction of the cooling rate can prolong the crystallization time and effectively refine the crystal morphology inside the material, making the size of the spherical crystal larger and the crystallinity higher. The higher cooling rate leads to a lower dielectric constant and higher conductivity of the XLPE material, which also causes a decrease in the AC breakdown field strength of the material at different temperatures.
Keywords
Crystal Morphology;Breakdown Properties;XLPE;Mesoscale
Speaker
You Wu
Tianjin University

Submission Author
You Wu Tianjin University
Boxue Du Tianjin University
Zhonglei Li Tianjin University
Yuming Dong Tianjin University
Heyu Wang Tianjin University
Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    Sep 25

    2022

    to

    Sep 29

    2022

  • Aug 15 2022

    Early Bird Registration

  • Sep 10 2022

    Contribution Submission Deadline

  • Nov 10 2022

    Registration deadline

  • Nov 30 2022

    Draft paper submission deadline

  • Nov 30 2022

    Final Paper Deadline

Sponsored By
IEEE DEIS
Organized By
Chongqing University
Contact Information