Presentation Details
The deterioration mechanism of the mechanical and electrical properties of insulating cardboard under mechanical force
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Updated Time：2022-09-09 13:57:53
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Abstract
In this paper, we constructed the cellulose model of insulating cardboard, studied the changing process of the micro performance index of insulating paper under the action of mechanical force, and designed the mechanical force aging experiment under different aging times, and studied the mechanical properties. Simulation results showed that mechanical force can aggravate the movement of insulating cardboard fiber chain and cause decreased cellulose stability. The measurement results show that degree of polymerization of insulating cardboard was decreased. After the discussion of the results, we come to the conclusion that mechanical force aggravates the deterioration of insulating paper and the researchers may focus on the revealing of the quantitative relation between mechanical force volume and the movement extent of the cellulose chain. This paper expounds the degradation mechanism of the insulating paper properties from macro perspective and micro-prospective, which provides a reliable basis and data support for the subsequent insulation ability judgment of the insulating cardboard.
Keywords
Converter transformer,Oil-paper insulation,Aging mechanism,Molecular dynamics simulation
Speaker
Zihao Li
Shandong UniversitySubmission Author
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Important Date
-
Conference Date
Sep 25
2022
toSep 29
2022
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Aug 15 2022
Early Bird Registration
-
Sep 10 2022
Contribution Submission Deadline
-
Nov 10 2022
Registration deadline
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Nov 30 2022
Draft paper submission deadline
-
Nov 30 2022
Final Paper Deadline
Sponsored By
IEEE DEIS
Organized By
Chongqing University
Contact Information
- Zhengyong Huang
- 61******@qq.com
Previous Conferences
-
2020-09-06 China Beijing
2020 IEEE International Conference on High Voltage Engineering and Application -
2018-09-10 Greece
2018 IEEE International Conference on High Voltage Engineering and Application -
2016-09-19 China Chengdu, China
2016 IEEE International Conference on High Voltage Engineering and Application
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