Modeling of Space Charge Measurement for Dielectrics with Tip-to-plate Electrode Configuration
ID:376 View Protection:ATTENDEE Updated Time:2022-08-29 16:00:58 Hits:300 Poster Presentation

Start Time:Pending(Asia/Shanghai)

Duration:Pending

Session:No Session »

Presentation File

Tips: Only the registered participant can access the file. Please sign in first.

Abstract
Pulsed electro-acoustic method (PEA) is widely used to measure the accumulated charge in dielectrics. Existing researches mainly focus on flat and coaxial geometries, which contain a uniform electric field. However, more serious space charge accumulation usually occurs due to the concentration of local electric field when a tip defect appears in dielectrics. A simulation model was established to study the generation and transmission of acoustic wave in dielectrics with tip-to-plate electrode configuration which contains extremely uneven electric field. The acoustic wave generated at the interfaces of electrode and insulation is different from that in the conventional PEA apparatus. A reverse overshoot appears owing to the extremely uneven electric field which corresponds to the experimental results. 
Keywords
space charge,pulsed electroacoustic method,PEA,dielectrics,electric field concentration,Tip-to-plate Electrode
Speaker
Penglong He
Tsinghua University

Submission Author
Penglong He Tsinghua University
Bo Zhang Tsinghua University
Yang Zhao State Grid Beijing Electric Power Company
Xianwei Ma State Grid Beijing Electric Power Company
Tian Guo State Grid Beijing Electric Power Company
Yi Zhou State Grid Beijing Electric Power Company
Rong Xia China Electric Power Research Institute
Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    Sep 25

    2022

    to

    Sep 29

    2022

  • Aug 15 2022

    Early Bird Registration

  • Sep 10 2022

    Contribution Submission Deadline

  • Nov 10 2022

    Registration deadline

  • Nov 30 2022

    Draft paper submission deadline

  • Nov 30 2022

    Final Paper Deadline

Sponsored By
IEEE DEIS
Organized By
Chongqing University
Contact Information