Study on improving thermal properties of cured epoxy resin modified by bisphenol AF chain extension
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Abstract
IEEE ICHVE 2022 / 1-PAGE ABSTRACT
Study on improving thermal properties of cured epoxy resin modified by bisphenol AF chain extension
Yushun Zhao,Mingfei Zhang,Hongli Dou,Song Zhang,Tianqi Hou,Yinjun Shi
School of Electrical Engineering and Automation, Hefei University of Technology , Hefei, China
yushunzhao@126.com, 2570831144@qq.com, 1923902554@qq.com, zsong20@126.com,
qdhoutq@126.com, 2020110348@mail.hfut.edu.cn
Purpose/Aim
Basin insulators are an important part of gas insulated switchgear (GIS). The development of compact GIS requires higher heat resistance of basin insulators.  The heat resistance of a basin insulator depends on the thermal properties of its internal epoxy insulating material.  In view of the lack of research on improving the thermal properties of epoxy resin, bisphenol AF was used to carry out chain extension modification of epoxy resin, and the thermal properties of the modified epoxy resin were studied.  
 Experimental/Modeling methods
Different contents of bisphenol AF were used to modify the epoxy resin by chain extension, and the epoxy value and infrared test were carried out.  On this basis, the chain extension epoxy resin was prepared, and the thermal properties of the chain extension epoxy resin were studied.  
Results/discussion
The results show that bisphenol AF achieves the purpose of chain extension modification of epoxy resin, improves the glass transition temperature of epoxy resin and the thermal decomposition temperature of epoxy resin to a certain extent. This is consistent with the existing results and theories.
Conclusions
Bisphenol AF introduced -CF3 with large group volume into the cured epoxy resin system, which made it difficult to rotate the polymer bond and break the chemical bond, thus improving the thermal properties of epoxy resin.  
 
Keywords
epoxy resin insulating material,chain extension modification, thermal properties,glass transition temperature,thermal decomposition temperature
Speaker
Mingfei Zhang
School of Electrical Engineering and Automation, Hefei University of Technology , Hefei, China

Submission Author
Yushun Zhao School of Electrical Engineering and Automation, Hefei University of Technology , Hefei, China
Mingfei Zhang School of Electrical Engineering and Automation, Hefei University of Technology , Hefei, China
Hongli Dou School of Electrical Engineering and Automation, Hefei University of Technology , Hefei, China
Song Zhang School of Electrical Engineering and Automation, Hefei University of Technology , Hefei, China
Tianqi Hou School of Electrical Engineering and Automation, Hefei University of Technology , Hefei, China
Yinjun Shi School of Electrical Engineering and Automation, Hefei University of Technology , Hefei, China
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    Sep 25

    2022

    to

    Sep 29

    2022

  • Aug 15 2022

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  • Sep 10 2022

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  • Nov 10 2022

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  • Nov 30 2022

    Draft paper submission deadline

  • Nov 30 2022

    Final Paper Deadline

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