Electro-thermal Modeling and Verification of MOV in SPD Based on Various Experiments
ID:597 View Protection:ATTENDEE Updated Time:2022-08-29 16:23:11 Hits:373 Poster Presentation

Start Time:Pending(Asia/Shanghai)

Duration:Pending

Session:No Session »

Video No Permission Presentation File

Tips: Only the registered participant can access the file. Please sign in first.

Abstract
Metal oxide varistor (MOV) is an important component for suppressing overvoltage and diverting surge current in modern power systems. Its excellent nonlinear resistance characteristics has been widely used in the manufacture of metal oxide arresters (MOAs), surge protective devices (SPDs) and other overvoltage protection products. Although the temperature increase of MOV in SPD will lead a significant decrease in performance or even a failure, there are very few studies describing its electro-thermal modeling. Therefore, in this paper, the electro-thermal experiment including 10mA DC thermal stability experiment, temporary overvoltage (TOV) experiment and 8/20μs impulse experiment are performed on the MOV sample firstly. Then the temperatures of different parts of the MOV samples are measured with the help of thermocouples and infrared camera. Moreover, by establishing 3D MOV thermal model, the temperatures of the MOV in experiment are compared with these in the simulation. The results show that the experimental measurements are in well agreement with the simulation results, which verifies the validity of the proposed model.
 
Keywords
Metal oxide varistor (MOV), surge protective device (SPD), electro-thermal experiment, electro-thermal model.
Speaker
Qibin Zhou
Senior Engineer Shanghai university

Submission Author
Qibin Zhou Shanghai university
Ting Cao Shanghai University
Xin Huang Shanghai University
Yabin Liu Shanghai University
Bin Shao Shanghai University
Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    Sep 25

    2022

    to

    Sep 29

    2022

  • Aug 15 2022

    Early Bird Registration

  • Sep 10 2022

    Contribution Submission Deadline

  • Nov 10 2022

    Registration deadline

  • Nov 30 2022

    Draft paper submission deadline

  • Nov 30 2022

    Final Paper Deadline

Sponsored By
IEEE DEIS
Organized By
Chongqing University
Contact Information