2022 IEEE International Conference on High Voltage Engineering and Application (ICHVE 2022)

BN is a kind of effective fillers for electrical modification of meta-aramid paper, and coupling agent treatment is the key step in the composition process. However, there were few studies on the optimization of coupling agent for BN/meta-aramid system. The relationship between the agent groups and the paper performance is not revealed, and the modification mechanism of BN-aramid interface is not clear, causing a lack of scientific basis for the selection of coupling agent. In this study, with hydroxylation treatment as the reference group, BN was modified by triethoxysilane with four types of organophilic groups, including sulfhydryl propyl (MP), glycidyl ether propyl (GP), amino-propyl (AP) and fluorooctane (TFO). Then it was doped into aramid paper by wet paper-making. The physico-chemical characteristics, electrical performance and other related properties of BN/ meta-aramid paper were tested. The interface interaction was simulated by molecular dynamics (MD) method. The possible modification regulation was described from the aspects of micro-interface, meso-defect and macro paper structure, with the selection strategy of coupling agent proposed accordingly.

meta-aramid,BN,coupling agent,insulation strength,molecular dynamics