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Two-dimensional material film for thermal management of electronic devices
ID：233 View Protection：ATTENDEE Updated Time：2024-04-30 10:34:09 Hits：528 Oral Presentation

Start Time：Pending（Asia/Shanghai）

Duration：Pending

Session：No Session »

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Abstract
The rapid proliferation of electronic devices has led to a consequential surge in the demand for thermal management products. However, this growth has paralleled a concerning increase in electronic waste (e-waste) generated by these products, posing significant environmental and resource depletion challenges. The conventional thermal management materials, predominantly comprising high-purity metals and mineral materials, pose recycling challenges due to their integration within electronic components.
This research project addresses these challenges by proposing the utilization of two-dimensional materials for interface heat transfer in composite films. Specifically, boron nitride (BN) is explored as a promising two-dimensional material in combination with various solid wastes to develop biodegradable composite films with superior thermal and mechanical properties. One such endeavor involves the preparation of a biodegradable, highly thermally conductive composite film utilizing mango waste, a substantial byproduct of mango processing industries.
Mango waste, comprising peels and kernels, accounts for a significant portion of the fruit's total volume and presents environmental and economic concerns due to its high generation rate and insufficient treatment. By integrating mango waste into composite films alongside two-dimensional materials, we aim to not only repurpose solid waste but also mitigate environmental issues associated with both solid waste and e-waste.
This research endeavors to contribute to the development of sustainable solutions for thermal management in electronic devices while addressing pressing environmental challenges posed by waste accumulation.
 
Keywords
Thermal Management
Speaker
ZhongYueni
Monash University

Submission Author
ZhongYueni Monash University
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Important Date

  • Conference Date

    May 31

    2024

    to

    Jun 03

    2024

  • Jun 03 2024

    Abstract Submission Deadline

  • Jun 03 2024

    Draft paper submission deadline

  • Jun 03 2024

    Registration deadline

Sponsored By
Panel of Computational Mechanics on Granular Materials
Working Party of Computational Mechanics
Chinese Society of Theoretical and Applied Mechanics
Organized By
Hohai University
Dalian University of Technology
Chinese Society of Particuology
Jiangsu Society of Theoretical and Applied Mechanics
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