7th International Conference on Matter and Radiation at Extremes (ICMRE2024)

    When a high-power laser pulse is focused onto a metal target, It will driven an attenuated shock wave in metal, which will cause dynamic damage of metal materials when the shock wave is reflected and unloaded from the surface of metal. When the shock wave breads out at the free surface of the target, it reflects a release wave. The interaction of the reflected and incident release wave produces tensile stresses, which may fragment one or more layers from the sample. When the shock pressure is high enough an the material has been melted partially of fully during the propagation of the incident pulse , tensile stress is generated in a liquid medium, leading to the formation of an expanding cloud of molten droplets, with a wide range of fragment sizes an ejection velocities.
    In the past decade, the strong laser loading material characteristics research team of the Laser Fusion Research Center of the Chinese Academy of Sciences has conducted cutting-edge exploration research on microspall and micro ejection damage of metal materials under dynamic high-pressure loading based on the Shenguang series laser device and the SGIII laser device. The focus has been on the dynamic damage and failure process of metal material interfaces under sequential loading pressure and different surface disturbance conditions, as well as the development and evolution law of damaged and broken particles. We have successfully established diagnostic measurement techniques such as visible light framing shadow imaging, interface velocity measurement, and high-energy X-ray backlight perspective photography suitable for strong laser shock loading experiments. The experiments have obtained rich physical image information and data. This report introduces the experimental research progress and future research prospects of material damage and failure under laser driven shock loading conducted by the research team in recent years.
 

laser drive shock loading, metal, microspall, microejection, damage