基于热扩散制备金钴镀层及其摩擦学性能
ID:478 View Protection:ATTENDEE Updated Time:2026-04-18 19:23:01 Hits:100 Oral Presentation

Start Time:2026-04-28 18:05(Asia/Shanghai)

Duration:15min

Session:N 微弧氧化及电化学沉积技术论坛 » N2N下午场

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Abstract
Friction and wear significantly limit the performance and service life of mechanical components, yet metallic coatings remain essential for electrical and thermal conductivity in applications such as connectors. In this work, Co-Au coatings were fabricated on Ni-P-coated copper substrates via a chemical plating method, followed by thermal diffusion annealing at 350 °C for 1 h. The as-deposited coatings exhibit a continuous granular structure with an Au-rich top layer and a nanocrystalline Co-rich layer beneath, while annealing induces interdiffusion between Au and Co, forming a Co-Au solid solution. This microstructural evolution leads to enhanced hardness, optimized H/E ratio, and improved load-bearing capacity. Tribological tests reveal that annealed Co-Au coatings exhibit a reduced and stable coefficient of friction compared with Co and as-deposited Co-Au coatings under identical test conditions (~0.14), corresponding to a reduction of approximately 77% compared with the as-deposited Co-Au coatings (~0.60). Meanwhile, the wear track width decreases from ~138 μm to ~70 μm, indicating a reduction of about 49%. Corrosion resistance is improved after annealing, as evidenced by lower corrosion current density and a more positive open-circuit potential. The results demonstrate that the combination of chemical plating and thermal diffusion provides an effective strategy to produce structurally stable Co-Au coatings with excellent mechanical, tribological, and corrosion-resistant properties, suitable for complex-shaped conductive components.
Keywords
chemical plating,thermal diffusion,tribological performance
Speaker
叶浩辉
中国科学院兰州化学物理研究所

Submission Author
叶浩辉 中国科学院兰州化学物理研究所
张兴凯 中国科学院兰州化学物理研究所
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Important Date
  • Conference Date

    Aug 10

    2026

    to

    Aug 12

    2026

  • Apr 26 2026

    Draft paper submission deadline

  • Apr 28 2026

    Registration deadline

Sponsored By
中国机械工程学会
Organized By
中国机械工程学会表面工程分会
中国科学院兰州化学物理研究所 润滑材料全国重点实验室
中国航天科技集团兰州空间技术物理研究所
甘肃省化学会
甘肃省材料学会
兰州城市学院