2014 IEEE Global High Tech Congress on Electronics (GHTCE 2014)

148 / 1971-01-01 00:00:00

A Novel Method Of Mems Vacuum Packaging

5241

With the development of the Internet of Things, more and more MEMS products had been applied to this area. The performance of these products increasingly gained widespread attentions. Over the years, MEMS vacuum packaging technology had been a technical problem. Without solving this problem, MEMS applications on the Internet of Things would be subject to certain restrictions. Although a lot of researches had conducted on vacuum packaging technology, the low leakage rate of MEMS device-level vacuum packaging still couldn’t be really achieved. For these reasons, a new vacuum packaging method-electron beam welding technology (EBW)-was proposed. A vacuum packaging MEMS envelope sealed by electron beam welding technology was designed and implemented. The possibility of electron beam welding technology sealing the MEMS envelope in vacuum was studied and the process parameters of the technology were identified by a series of exploring experiments. Measured by the Helium Mass Spectrometer Leak Detector, the leakage rates of the cavities were in the order of 10-10Pa•m3/s, indicating that this method satisfies the requirements of low leakage rate of device-level MEMS vacuum packaging.