Introduction

The International Symposium on Networks-on-Chip (NOCS) is the premier event dedicated to interdisciplinary research on on-chip, chip-scale, and multichip package-scale communication technology, architecture, design methods, applications and systems. NOCS brings together scientists and engineers working on NoC innovations and applications from inter-related research communities, including computer architecture, networking, circuits and systems, packaging, embedded systems, co-design, and design automation.

Call for paper

Important date

2017-05-08
Abstract submission deadline
2016-05-15
Draft paper submission deadline
2017-07-01
Draft paper acceptance notification
2017-08-01
Final paper submission deadline

Submission Topics

The International Symposium on Networks-on-Chip (NOCS) is the premier event dedicated to interdisciplinary research on on-chip, chip-scale, and multichip package scale communication technology, architecture, design methods, applications and systems. NOCS brings together scientists and engineers working on NoC innovations and applications from inter-related research communities, including computer architecture, networking, circuits and systems, packaging, embedded systems, and design automation. Topics of interest include, but are not limited to:

NoC Architecture and Implementation

  • Network architecture (topology, routing, arbitration)
  • NoC Quality of Service
  • Timing, synchronous/asynchronous communication
  • NoC reliability issues
  • Network interface issues
  • NoC design methodologies and tools
  • Signaling and circuit design for NoC links
     

NoC Application

  • Mapping of applications onto NoCs
  • NoC case studies, application-specific NoC design
  • NoCs for FPGAs, structured ASICs, CMPs and MPSoCs
  • NoC designs for heterogeneous systems, fused CPU-GPU architectures, FPGA-based systems, etc
  • Scalable modeling of NoCs

Novel NoC Technologies

  • New physical interconnect technologies, e.g., carbon nanotubes, wireless NoCs, through-silicon, etc.
  • NoCs for 3D and 2.5D packages
  • Package-specific NoC design
  • Optical, RF, & emerging technologies for on-chip/in-package interconnects
  • In-memory network and NoCs for new memory technologies
     

NoC at the Un-Core and System-level

  • Design of memory subsystem (un-core) including memory controllers, caches, cache coherence protocols in NoCs
  • NoC support for memory and cache access
  • OS support for NoCs
  • Programming models including shared memory, message passing, and novel programming models
  • Issues related to large-scale systems (datacenters, supercomputers) with NoC-based systems as building blocks

NoC Analysis and Verification

  • Power, energy and thermal issues (at the NoC, un-core and/or system-level)
  • Benchmarking & experience with NoC-based hardware
  • Modeling, simulation, and synthesis of NoCs
  • Verification, debug, and test of NoCs
  • Metrics and benchmarks for NoCs
     

On-Chip Communication Optimization

  • Communication efficient algorithms
  • Communication workload characterization and evaluation
  • Energy efficient NoCs and energy minimization
     

Off-Chip and Rack-Level Communication

  • All aspects of inter-chip network design
  • All aspects of rack-level network design
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Important Date
  • Conference Date

    Oct 19

    2017

    to

    Oct 20

    2017

  • May 15 2016

    Draft paper submission deadline

  • May 08 2017

    Abstract Submission Deadline

  • Jul 01 2017

    Draft Paper Acceptance Notification

  • Aug 01 2017

    Final Paper Deadline

  • Oct 20 2017

    Registration deadline

Sponsored By
IEEE Circuits and Systems Society
IEEE Council on Electronic Design Automation
Association for Computing Machinery
Supported By
IEEE Circuits and Systems Society
IEEE Council on Electronic Design Automation