Introduction

Join us for our 25th year of an information-packed three-day Symposium about the latest in High Performance Interconnects. IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.

Two days of technical sessions and a day of tutorials are waiting for you, to keep you on the top of the latest developments in industry and academia. 

Our objective is to address the Data-Center Networking and the Supercomputing communities. This year we are proud to have Ada Gavrilovska, Georgia Tech, and Eitan Zahavi, Mellanox, as our 2017 IEEE Hot Interconnects General Chairs. 

We hope you can join us and benefit not only by the content but also by the prime networking opportunities this event always offers.

Call for paper

Important date

2017-05-05
Abstract submission deadline
2017-05-12
Draft paper submission deadline
2017-06-09
Draft paper acceptance notification

Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, datacenters and Clouds. This yearly conference is attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field.

Themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols for high-performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation. In addition to those subscribing to the main theme of the conference, contributions are also solicited in the topics listed below.

Building on last year's successful technical program, keynotes, sessions, and panels on datacenter networking and their requirements, and solutions, in 2017 Hot Interconnects moves to Ericsson, Santa Clara, CA for the conference. This year's conference focuses on data-center, virtualized, and cloud networking. We hope you can join us there.

Submission Topics

Themes

  • Novel and innovative interconnect architectures

  • Multi-core processor interconnects

  • System-on-Chip Interconnects

  • Advanced chip-to-chip communication technologies

  • Optical interconnects

  • Protocols and interfaces for inter-processor communication

  • Survivability and fault-tolerance of interconnects

  • High-speed packet processing engines and network processors

  • System and storage area network architectures and protocols

  • High-performance host-network interface architectures

  • High-bandwidth and low-latency I/O

  • Pb/s switching and routing technologies

  • Innovative architectures for supporting collective communication

  • Novel communication architectures to support cloud computing

  • Centralized and distributed cloud interconnects

  • Requirements driving high-performance interconnects

  • Traffic characterization for HPC systems and commercial datacenters

  • Software for Network/Fabric Bring-up, Configuration and Performance
    Management, e.g., OpenFlow or OpenSM

  • Data Center networking

Guidlines

Paper format
We invite papers to be submitted either as regular, long papers (6-8 pages) or as short papers (3-4 pages). Short papers could be positional papers, industry papers, or papers describing hot-off-the-press breaking research results, and will judged accordingly and independently from the regular papers.

Publication & Presentation

Papers accepted s will be included in proceedings by the IEEE and appear on IEEE Xplore. Papers accepted will be presented at the HotI symposium.

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Important Date

  • Conference Date

    Aug 28

    2017

    to

    Aug 30

    2017

  • May 05 2017

    Abstract Submission Deadline

  • May 12 2017

    Draft paper submission deadline

  • Jun 09 2017

    Draft Paper Acceptance Notification

  • Aug 30 2017

    Registration deadline

Sponsored By
IEEE Computer Society
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