2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Apr. 15 - 18, 2018

· France

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Timetable

Timezone：Asia/Beijing

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Important Date

Conference Date

Apr 15

2018

to

Apr 18

2018
Oct 01 2017

Abstract Submission Deadline
Dec 20 2017

Draft Paper Acceptance Notification
Mar 18 2018

Final Paper Deadline
Apr 18 2018

Registration deadline

Sponsored By

IEEE

Contact Information

Olivier de Saint Leger
ol******@astefo.com

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2016-04-17 France Montpellier, France
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
2015-04-19 United States
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)