Timetable

Timezone：Asia/Beijing

No timetable available.
Important Date

  • Conference Date

    Sep 25

    2018

    to

    Sep 26

    2018

  • Feb 28 2018

    Abstract Submission Deadline

  • Jun 30 2018

    Draft paper submission deadline

  • Jul 31 2018

    Draft Paper Acceptance Notification

  • Aug 31 2018

    Final Paper Deadline

  • Sep 26 2018

    Registration deadline

Sponsored By
IEEE Electronics Packaging Society
Organized By
Research Association Molded Interconnect Devices 3-D MID e.V.
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