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Introduction

The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to invite you to Łódź.

The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices.
The MIXDES conference papers are indexed in INSPEC, Web of Science and available in IEEE Xplore.

Call for paper

Important date

2018-02-28
Draft paper submission deadline
2018-07-30
Draft paper acceptance notification
2018-05-15
Final paper submission deadline

The topics of the MIXDES  Conference include:

  1. Design of Integrated Circuits and Microsystems
    Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
  2. Thermal Issues in Microelectronics
    Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.
  3. Analysis and Modelling of ICs and Microsystems
    Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.
  4. Microelectronics Technology and Packaging
    New microelectronic technologies. Packaging. Sensors and actuators.
  5. Testing and Reliability
    Design for testability and manufacturability. Measurement instruments and techniques.
  6. Power Electronics
    Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
  7. Signal Processing
    Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
  8. Embedded Systems
    Design, verification and applications.
  9. Medical Applications
    Medical and biotechnology applications. Thermography in medicine.

Submission Topics

  1. Design of Integrated Circuits and Microsystems: Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
  2. Thermal Issues in Microelectronics: Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.
  3. Analysis and Modelling of ICs and Microsystems: Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.
  4. Microelectronics Technology and Packaging: New microelectronic technologies. Packaging. Sensors and actuators.
  5. Testing and Reliability: Design for testability and manufacturability. Measurement instruments and techniques.
  6. Power Electronics: Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
  7. Signal Processing: Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
  8. Embedded Systems: Design, verification and applications.
  9. Medical Applications: Medical and biotechnology applications. Thermography in medicine.

Guidlines

Full papers should be submitted to the Organising Committee only in electronic form (MS Word, OpenOffice Writer, Rich Text Format, LaTeX or PDF document). The required format is available on the Conference Web page. Authors are asked to indicate the topic into which their papers fall. Papers presented at the conference will be printed in the proceedings directly from the files submitted by the authors. The submissons should be done via www.mixdes.org only.

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Important Date

  • Conference Date

    Jun 21

    2018

    to

    Jun 23

    2018

  • Feb 28 2018

    Draft paper submission deadline

  • May 15 2018

    Final Paper Deadline

  • Jun 23 2018

    Registration deadline

  • Jul 30 2018

    Draft Paper Acceptance Notification

Organized By
Lodz University of Technology
Gdynia Maritime University
Warsaw University of Technology
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