2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Thermal Phenomena, Simulation and Experiment

• Thermal management of electronic component and systems

• Classical and modern thermometry and thermography

• Multi-physics simulation and fi eld coupling

• Thermal interface materials

• Thermal modelling and investigation of packages

• Power electronics • High Temperature electronics

• Solid state lighting / LED’s

• Thermal characterisation of micro and nano domains

• CFD modelling and benchmarking

• Advanced thermal materials

• Heat transfer on the nano-scale

• Thermal performance of interconnects

• Temperature mapping

• Electro-thermal interactions

• Nanotechnology applications

• Flow visualisation

Electronics Cooling Concepts

• Thermo-electric cooling

• Novel and advanced cooling technologies

• Sub-ambient cooling

• Heat pipe assisted cooling

• 3D integration and cooling concepts

• Cooling concepts: air, liquid, etc.

• Ultra low form factor air cooling

• Novel manufacturing methods

Thermo-Mechanical Reliability

• Thermo-mechanical reliability

• Prognostics and health monitoring

• Lifetime modelling and prediction

• Damage and fracture mechanics