Introduction
Technical debt describes a universal software development phenomenon: design or implementation constructs that are expedient in the short term but set up a technical context that can make future changes more costly or impossible. Software developers and managers increasingly use the concept to communicate key tradeoffs related to release and quality issues. The goal of this two-day conference is to bring together leading software researchers, practitioners, and tool vendors to explore theoretical and practical techniques that manage technical debt.
The Managing Technical Debt workshop series has provided a forum since 2010 for practitioners and researchers to discuss issues related to technical debt and share emerging practices used in software-development organizations. A week-long Dagstuhl Seminar on Managing Technical Debt in Software Engineering has produced a consensus definition for technical debt, a draft conceptual model, and a research roadmap.
To accelerate progress, an expanded two-day working conference format has become essential. The inaugural edition of the TechDebt Conference will be held jointly with ICSE 2018 in Gothenburg, Sweden, May 27–28, 2018. The conference is sponsored by ACM SIGSOFT and IEEE TCSE.
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Important date
The First International Conference on Technical Debt will be held in Gothenburg, Sweden, on May 27-28, 2018 collocated with ICSE 2018.
Technical debt is a metaphor that software developers and managers increasingly use to communicate key tradeoffs related to release and quality issues. The Managing Technical Debt workshop series had, since 2010, brought together practitioners and researchers to discuss and define issues related to technical debt and how they can be studied. Workshop participants reiterated the usefulness of the concept each year, shared emerging practices used in software development organizations, and emphasized the need for more research and better means for sharing emerging practices and results.
As the interest from our industry and academic researchers in Technical Debt has steadily grown, the workshop series has morphed into a full conference in 2018. Our goal for this conference on Technical Debt is to bring together leading software engineering researchers and practitioners for the purpose of exploring theoretical and practical techniques for managing technical debt.
Topics of interest
The following topics are aligned with the conference theme:
- Identification of technical debt
- Visualization of technical debt
- Analysis of technical debt
- Metrics for technical debt
- Economic models for describing or reasoning about technical debt
- Understanding causes and effects of technical debt
- Relationship of technical debt to software evolution, maintenance, and aging
- Relationship of technical debt with other activities, such as testing or requirement elicitation
- The business case for technical debt management
- Technical debt and software life-cycle management
- Technical debt within a software ecosystem
- Technical debt in designs and architecture
- Technical debt in software models
- Techniques and tools for calculating technical debt principal and interest
- Concrete practices and tools used to measure and control technical debt
- Education related to technical debt
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Important Date
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Conference Date
May 27
2018
toJun 03
2018
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Jan 15 2018
Abstract Submission Deadline
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Jan 22 2018
Draft paper submission deadline
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Mar 01 2018
Draft Paper Acceptance Notification
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Mar 15 2018
Final Paper Deadline
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Jun 03 2018
Registration deadline
Organized By
Contact Information
- Carolyn Seaman
- cs******@umbc.edu
Previous Conferences
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2025-04-27 Canada Ottawa
2025 IEEE/ACM International Conference on Technical Debt -
2021-05-19 Spain Madrid
2021 IEEE/ACM International Conference on Technical Debt
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