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Introduction

ISTP symposium series has been organized successfully since its first symposium of ISTP1 in Honolulu, Hawaii, and this year, it will be held again in Honolulu. The success of this symposium series owes a lot to the past contributors and organizers who have nurtured the spirit of academics and technological exchanges under a relaxing atmosphere, which is believed to be the essential foundation of the symposium.

Honolulu is therefore picked as the symposium venue which is one of the top tourist destinations. This is a huge opportunity for the participants to exchange up-to-date research and technological information as well as to deepen mutual relationship for future collaborations across the countries and regions in session rooms, at the coffee breaks and symposium events, and also at the various relaxing and exciting off-the-venue locations in Honolulu.

Committee

Symposium Chair:

Masaru Ishizuka, Toyama Prefectural University​

Symposium Co-Chair:

Kazuyoshi Fushinobu, Tokyo Institute of Technology​

Secretary General:

Tomoyuki Hatakeyama, Toyama Prefectural University​

Adviser:

Sadanari Mochizuki, Pacific Center of Thermal and Fluid Engineering, Tokyo University A & T

Honorary Committee:

Ishizuka, M., Toyama Prefectural University

Ay, H., National Kauohsiung Unversity of Applied Sciences

Brynjolfsson, S., University of Iceland

Cervantes de Gortari,J., National Univ. of Mexico

Chan, S. H., Yuan Ze University

Charoenphonphanich, C., KMITL

De Vahl Davis, G., Univ. of New South Wales

Dincer, I., University of Ontario Institute of Technology

Djilali, N., University of Victoria

Dost, S., University of Victoria

Hanamura, K., Tokyo Institute of Technology

Iguchi, M.,  Hokkaido University

Jezek, J., Czech Technical University in Prague

Lee, J. S., Seoul National University

Lee, S. Y., KAIST

Mallinson, G., University of Auckland

Mochizuki, S., Tokyo University of A&T

Rajapaksha, L., University of Peradenya

Raupenstrauch, H., Montanuniversitaet Leoben

Spitas, C., Delft University of Technology

Suzuki, K., Tokyo University of Science at Yamaguchi

Takeishi, K., Osaka Univesity

Tomimura, T., Kumamoto University

Wang, B. X., Tsinghua University

Winoto, S. H., National University of Singapore

Yanuar, University of Indonesia

Zuna, P., Czech Technical University in Prague

International Scientific Committee:

Agonafer, Dereje, University of Texas

Amano, Ryo S., University of Wisconsin-Milwaukee

Arima, Hirofumi, Saga University

Asano, Hitoshi, Kobe University

Atarashi, Takayuki, Hitachi, Ltd.

Bois, G., ENSAM Lille

Carlomagno, G.M., University of Napoles

Fukue, T., Iwate University

Fumoto, Koji, Aoyama Gakuin University

Fushinobu, K., Tokyo Institute of Technology

Haramura, Yoshihiko, Kanagawa University

Hatakeyama, T., Toyama Prefectural University

Hirasawa, Shigeki, Kobe University

Hirose, Koichi, Iwate University

Hirota, Masafumi, Mie University

Hong, C. W., National Tsing Hua University

Horibe, Akihiko, Okayama University

Horiuchi, Keisuke, Hitachi Co.Ltd.

Ichimiya, Koichi, University of Yamanashi

Inoue, M., KOMATSU

Iwai, Hiroshi, Kyoto University

Iwamoto, Kaoru, Tokyo University of Agriculture and Technology

Joshi, Y., Georgia Tech

Kajita, Yasushi, Nagoya Municipal Industrial Research Institute

Kano, Ichiro, Yamagata University

Kawanami, Tsuyoshi, Meiji University

Kedzierski, M., NIST

Kikura, Hiroshige, Tokyo Institute of Technology

Kim,  Sung Jin, KAIST

Kim, M.S., Seoul National University

Kobayashi, Kenichi, Meiji University

Koizumi, Katsuhiro, DENSO Corporation

Komiya, A., Tohoku University

Kondo, Yoshihiro, Hitachi, Ltd.

Kunugi, Tomoaki, Kyoto University

Kuwahara, Fujio, Shizuoka University

Kuzma-Kichta, Y. A., Moscow Power Eng. Institute

Li, H.Y., Huafan University

Maruyama, S., National Institute of Technology, Hachinohe College

Maruyama, Shigeo, The University of Tokyo

Matsumoto, Koji, Chuo University

Matsumoto, Mitsuhiro, Kyoto University

Matsumoto, Ryosuke, Kansai University

Matsushima, Hitoshi, Nihon University

Miyagawa, K., Waseda University

Miyazaki, Koji, Kyushu Institute of Technology

Monde, M., Saga University

Motosuke, Masahiro, Tokyo University of Science

Munakata, Tetsuo, National Institute of Advanced Industrial Science and Technology

Murata, Akira, Tokyo University of Agriculture and Technology

Nagai, Niro, University of Fukui

Nagasaka, Yuji, Keio University

Nagayama, Gyoko, Kyushu Institute of Technology

Nakabe, Kazuyoshi, Kyoto University

Nakabeppu, Osamu, Meiji University

Nakagawa, Shinji, Toyama Prefectural University

Nakamura, Hajime, National Defense Academy

Nakamura, Yuji, Toyohashi University of Technology

Nakayama, Akira, Shizuoka University

Naylor, D., Ryerson University

Ng, Eddie, Nanyang Technical University

Nishi, Koji, NIDEC Corporation

Nomura, Shinfuku, Ehime University

Oda, Y., Kansai University

Ogushi, Tetsuro, Advanced Knowledge Laboratory, Inc.

Ohara, T., Tohoku University

Ohmura, Takahiro, National Institute of Technology, Wakayama College

Okajima, Junnosuke, Tohoku University

Okuyama, Masaaki, Yamagata University

Osone, Yasuo, Hitachi, Ltd.

Ozawa, Mamoru, Kansai University

Rosengarten, G., University of New South Wales

Roy, R.P., Arizona State University

Saito, Takushi, Tokyo Institute of Technology

Saitoh, Hironori, Sojo University

Satoh, Isao, Tokyo Institute of Technology

Senaha, Izuru, Ryukyu University

Shibahara, M., Osaka University

Shiomi, Junichiro, The University of Tokyo

Shirakashi, Ryo, The University of Tokyo

Someya, S., AIST

Suzuki, Hiroshi, Kobe University

Suzuki, K, Tokyo University of Science at Yamaguchi

Tabe, Yutaka, Hokkaido University

Tada, Yukio, Kanazawa University

Takata, Y., Kyushu University

Takeda, Tetsuaki, University of Yamanashi

Tanahashi, Mamoru, Tokyo Institute of Technology

Tomimura, T., Kumamoto University

Tong, Albert Y., University of Texas at Arlington

Torii, S., Kumamoto University

Toriyama, Koji, University of Yamanashi

Ueno, Ichiro, Tokyo University of Science

Vafai, K., UC Riverside

Wang, Q., Xi'an Jiaotong University

Yamada, Masahiko, Hokkaido University

Yang, Chien-Yuh, National Central University

Yazawa, Kazuaki, Purdue University

Yeh, L-T, Huawei Technologies

Yokono, Yasuyuki, The University of Tokyo

Yuki, K., Tokyo University of Science at Yamaguchi​

Executive Committee:

Fushinobu, Kazuyoshi (Chair), Tokyo Institute of Technology

Hatakeyama, Tomoyuki (General Secretary), Toyama Prefectural University

Doan, Hong Duc, Vietnam National University at Hanoi

Fukue, Takashi, Iwate University

Hasmady, Saiful, Tenaga National University

Kibushi, Risako, Tokyo University of Science at Yamaguchi

Kim, Byunggi, KAIST

Koizumi, Katsuhiro, DENSO Corporation

Nishi, Koji, Nidec Corporation

Saitoh, Hironori, Sojo University

Yazawa, Kazuaki, Perdue University

Yokono, Yasuyuki, University of Tokyo

Yuki, Kazuhisa, Tokyo University of Science at Yamaguchi

Call for paper

Important date

2018-05-15
Abstract submission deadline
2018-06-01
Draft paper submission deadline
2018-07-27
Draft paper acceptance notification
2018-08-15
Final paper submission deadline

SCOPE

Papers dealing with any aspect of transport phenomena and thermal-fluids engineering from fundamental sciences to applications in engineering systems and nature are solicited. Topics include but are not restricted to the following areas:

  • Bioengineering and Bio-thermal Fluid Dynamics

  • Boiling and Multi-Phase Flow

  • Combustion and Reacting Flows

  • Electronics Packaging and Thermal Management

  • Experimental/Computational Fluid Dynamics

  • Fuel Cells and Battery Technology

  • Heat and Mass Transfer

  • Heat Exchangers

  • Industrial Aerodynamics

  • Manufacturing and Materials Processing

  • MEMS

  • Micro- and Nano-Scale Transport

  • Noise and Vibration in Fluid

  • Sustainable & Renewable Energy

  • Thermal-Fluids Machinery

  • Thermal Hydraulics of Energy Reactors

  • Transport in Porous Media

  • Transport phenomena in solid mechanics and fluid-structure interaction

  • Turbulence and Flow Instabilities

  • Visualization/Imaging Techniques

Guidlines

Submission Guidelines

All papers must be original and not simultaneously submitted to another journal or conference. Author are invited to submit an abstract not exceeding 150 words to EasyChair via https://easychair.org/conferences/?conf=istp29 by May 1, 2018.

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Important Date
  • Conference Date

    Oct 30

    2018

    to

    Nov 02

    2018

  • May 15 2018

    Abstract Submission Deadline

  • Jun 01 2018

    Draft paper submission deadline

  • Jul 27 2018

    Draft Paper Acceptance Notification

  • Aug 15 2018

    Final Paper Deadline

  • Sep 01 2018

    Early Bird Registration

  • Nov 02 2018

    Registration deadline