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Introduction

The International Conference on Advanced Technologies for Communications is an annual conference series, since 2008, co-organized by the Radio & Electronics Association of Vietnam (REV) and the IEEE Communications Society (IEEE ComSoc).

The goal of the series is twofold: to foster an international forum for scientific and technological exchange among Vietnamese and worldwide scientists and engineers in the fields of electronics, communications and related areas, and to gather their high-quality research contributions.

In 2018, the ATC conference will be held in Ho Chi Minh city, Vietnam during October 18-20, 2018 and hosted by Posts and Telecommunications Institute of Technology. The conference will feature prominent invited speakers as well as papers by top researchers from all over the world.

Committee

Honorary Co-chairs

Nguyen Van Ngo, REV, VN

Phan Anh, REV, VN

Nguyen Ngoc Binh, REV, VN

Steering Co-chairs

Vu Van San, PTIT, VN

Nguyen Hong Vu, REV, VN

General Chairs

Hikmet Sari, NUPT, China

Tan Hanh, PTIT, VN

Truong Vu Bang Giang, REV, VN

Financial Co-Chairs

Pham Minh Quang, PTIT, VN

Local Arrangement Co-Chairs

Tran Trung Duy, PTIT, VN

Pham Thi Yen Linh, PTIT, VN

Tran Cong Hung, PTIT, VN

Publication Co-Chairs

Huynh Van Hoa, PTIT, VN

Publicity Co-Chairs

Hoang Hong Duc, REV, VN

Le Quang Phu, PTIT, VN

Tomohiko Taniguchi, Fujitsu Laboratories, JP

Call for paper

Important date

2018-05-30
Draft paper submission deadline
2018-07-30
Draft paper acceptance notification

The conference program will run for three days with the regular tracks, special sessions, and workshops. In addition, a number of tutorial sessions will be scheduled for one day before the conference starts. For the tracks and special sessions, we invite you to contribute your original work on topics in the following, but not limited to, areas:

Communications track

  • Communication Theory
  • Information & Coding Theory
  • Communication Quality, Reliability & Modeling
  • Wireless Communications

Signal Processing track

  • Signal, Image and Video Processing
  • Signal Processing for Communications
  • Signal processing for Big Data
  • Signal processing for the IoTs
  • Bio-imaging and biomedical signal processing
  • Telemedicine and E-hospital
  • Biomechanics

Integrated Circuits and Electronics track

  • Emerging IC technologies
  • VLSI Design Automation
  • Digital, Analog and Mixed-Signal ICs and Systems
  • RF IC Front-end and Transceivers
  • Low power design
  • SOC, SIP, IP
  • Electronic Circuits and Systems
  • Embedded Systems
  • Automation, Robotics and Control
  • Consumer and Automotive Electronics
  • Sensor Systems

 Networks track

  • Ad hoc & Sensor Networks
  • Computer Communications
  • Optical Networking
  • Satellite Communications
  • High-Speed Networking
  • Network Operations & Management

Microwave Engineering track

  • Microwave Theory & Techniques
  • RF, Microwave Circuits, Systems & Applications
  • Millimeter Wave, THz Technologies and Systems
  • Power Amplifier Devices and Circuits

Antennas and Propagation track

  • Antenna Systems
  • Integrated Antennas, Smart Antennas, Digital Beamforming, Related Circuits and Components
  • Electromagnetic Scattering, Channel Measurement and Propagation
  • Computational Methods for Wave Propagation

Guidlines

The authors are advised to download the “IEEE Template files“ in MS Word or Latex format to prepare the paper. The best way to have your paper met the format requirements is to copy and paste your paper into the template file.

Some points that needs to consider when preparing the camera ready paper are explained as follows

  • Only PDF format in Letter size (8.5×11 inches) is accepted for the camera ready paper submission
  • The standard page number of the paper is 4 pages. The maximum allowable number of pages is 6. In case of exceeding 6 pages, the author is obligated to pay 50USD per excess page.
  • Do not number the page of your manuscript
  • Do not use header or footer
  • Fonts: use only Times or Times Roman to edit your paper.
  • Title: The title should be in Times 24-point, normal type. Capitalize the first letter of nouns, pronouns, verbs, adjectives, and adverbs; do not capitalize articles, coordinate conjunctions, or prepositions (unless the title begins with such a word). The title should not be all in capital letters
  • Author name: The names of the authors are to be centered beneath the title and printed in Times 11-point, normal type.
  • Author’s name should not be preceded nor followed by author’s titles and society memberships.
  • Author Affiliation: The authors’ affiliations are to be centered beneath the author’s names and printed in Times 11-point, normal type. Affiliation should include: department/division, university/company, postal address, phone (optional), fax (optional), email (optional), and URL (optional). In the case of authors from different institutions, identify each institution with a number (starting from 1). At the end of the name of each author place the institution identifier as a superscript. List the institutions on separate lines with the format described above. Each institution should be preceded by the corresponding identifier as a superscript.
  • Keywords: keywords are not necessary for the conference paper
  • Figure: figures are centered in the column, large figures can be placed over two columns. The figure caption font size is 8-point.
  • Table: tables are centered in the column, large tables can be placed over two columns. The table caption font size is 8-point as for figures
  • Use of color: no color is used in the proceeding. Please transform your colored figures into grey-scale images before including them into the paper.
  • PDF requirement: please embed all local fonts into the PDF camera ready paper. Only papers which are compatible with IEEE Xplore requirements can be accepted.
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Important Date
  • Conference Date

    Oct 18

    2018

    to

    Oct 20

    2018

  • May 30 2018

    Draft paper submission deadline

  • Jul 30 2018

    Draft Paper Acceptance Notification

  • Oct 20 2018

    Registration deadline

Contact Information
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