The 15th IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)

383 / 2019-01-24 16:28:14

LC Low-pass filter based on through-silicon via

low-pass filter,through-silicon via (TSV),three-dimensional integrated circuits (3D IC)

Plenary track > Nanoelectronics

Low-pass filters (LPFs) are widely used in mobile terminals and many military radar receiver systems in order to alter the frequency spectrum of signals passing through it. So based on the technology of through-silicon via, we propose in this paper a third-order low-pass filter (LPF) which consists of planar spiral inductors and TSV array capacitor. The simulation result of proposed LPF shows that the cutoff frequency is about 20GHz and the ultra-compact size is only 10850 um². In addition, the components of TSV LPF are further investigated so as to figure the LPF characteristics clearly out.