2018 IEEE International Conference on Industrial Internet (ICII)

General Chair
Chenyang Lu, Washington University in St. Louis, USA 

Technical Program Committee Co-Chairs
Xiuzhen Cheng, The George Washington University, USA 
Thiemo Voigt, Uppsala University and RISE SICS, Sweden 
Guijun Wang, Boeing, USA 

Workshop Chairs
Sanjeev Mehrotra, Microsoft Research, USA 
Honggang Wang, UMass-Dartmouth, USA 

Panel Chairs
Andreas Mueller, Bosch, Germany 
Ye Ouyang, Verizon Wireless, USA 

Poster/Demo Chairs
Soumya Datta, Eurocom, France 
JaeSeung Song, Sejong University, Seoul, Korea 
Shaoen Wu, Ball State University, USA 

Publicity Chairs
Fan Bai, General Motors, USA
Payam Barnaghi, University of Surrey, UK
Madhanmohan Savadamuthu, Boeing India Technology Center, India
Rui Tan, Nanyang Technological University, Singapore 

Publication Chair
Reza Malekian, University of Pretoria, South Africa 

Event Chairs
Jiang Li, Howard Services, USA 
Wei Wang, Shenandoah Services, USA 

Local Chair
Yang Peng, University of Washington Bothell, USA    

Web Chairs
Yinhao Xiao, The George Washington University, USA 
Chao Wang, Washington University in St. Louis, USA 

Technical Program Committee Members
Tarek Abdelzaher, University of Illinois at Urbana-Champaign, USA 
Payam Barnaghi, University of Surrey, UK 
Giorgio C. Buttazzo, Scuola Superiore Sant Anna, Italy 
Jiannong Cao, Hong Kong Polytechnic University, China 
Octav Chipara, University of Iowa, USA 
Raymond Choo, University of Texas at San Antonio, USA 
Tushar Dani, Boeing Information Technology, USA 
Lijun Dong, Huawei, USA 
Chris Gill, Washington University in St. Louis, USA 
Aniruddha Gokhale, Vanderbilt University, USA 
Song Han, University of Connecticut, USA 
Yuan He, Tsinghua University, China 
JeongGil Ko, Ajou University, South Korea 
Zhongyuan Li, Verizon Wireless, USA 
Chieh-Jan Mike Liang, Microsoft Research, China 
Zhenyi Lin, Verizon Wireless, USA 
Luca Mottola, Politecnico di Milano and RISE SICS, Italy 
Klara Nahrstedt, University of Illinois at Urbana-Champaign, USA 
Lanshun Nie, Harbin Institute of Technology, China 
Ye Ouyang, Verizon Wireless, USA 
George Pappas, University of Pennsylvania, USA 
Gian Pietro Picco, Trento University, Italy 
Kay Roemer, TU Graz, Austria 
Abusayeed Saifullah, Wayne State University, USA 
Mo Sha, Binghamton University, USA 
Philipp Sommer, ABB, Switzerland 
Jack Stankovic, University of Virginia, USA 
Rui Tan, Nanyang Technological University, Singapore 
Lothar Thiele, ETH, Switzerland 
Eduardo Tovar, CISTER, Portugal 
Changzhou Wang, Boeing Global Services, USA 
Guoliang Xing, Michigan State University, USA 
Weiyi Zhang, AT&T Labs, USA 

Steering Committee
Vinton G. Cerf, Google, USA 
Mischa Dohler, King's College London, UK 
Mahmoud Daneshmand, Stevens Institute of Technology, USA 
Jae H Kim, Boeing Research & Technology, USA 
Chenyang Lu, Washington University in St. Louis, USA 
Weisong Shi , Wayne State University, USA 
Dinesh Verma, IBM Thomas J. Watson Research Center, USA 
Anwar Walid, Nokia Bell Labs, USA 
Chonggang Wang, InterDigital, USA