2018 IEEE International Test Conference in Asia (ITC-Asia 2018)

Topics of Interests include (but are not limited to) the following topics:
Special Promotion: Security/Trust, Validation/Debug, Safety and Test for Automotive ICs
 Hardware Oriented Security and Thrust
 Design Validation and Debug
 ATE Design
 Analog and Mixed-Signal Test
 RF Test
 High-Speed I/O Test
 Fault Modeling and Simulation
 ATPG (Automatic Test Pattern
Generation)
 Design for Testability
 Built-In Self-Test
 Delay Test
 System-on-Chip Test
 Test Compression
 Power-Aware and/or Thermal-Aware Test
 Memory Test, Diagnosis, and Repair
 Fault Diagnosis and Failure Analysis
 Yield Analysis and Learning
 Safety and Test for Automotive ICs
 Test for Internet of Things
 Test for Emerging Devices
 CPU/GPU Test
 MEMS/Sensor Test
 Online Test
 On-Chip Measurement
 SiP, 2.5D, and 3D IC Test
 Interconnect Test
 Board-Level Testing and Diagnosis
 Test Standards
 Test Economics
 Reliability Issues
 Fault Tolerance
 Test for Reconfigurable Systems
 Software Test and Reliability
 Dependable Systems and Networks