Introduction

SMTA and Chip Scale Review are pleased to announce the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

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Important Date

  • Conference Date

    Oct 23

    2018

    to

    Oct 25

    2018

  • Oct 25 2018

    Registration deadline

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