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3 / 2019-03-19 09:21:26
28nm Kelvin Via Rc Reduction in Metal Hard-mask based Cu/Ultra low-k Interconnects by Special Gas Base Plasma Etching Development
Plenary track
Draft Pending
Important Date

  • Conference Date

    Jun 09

    2019

    to

    Jun 10

    2019

  • Mar 31 2019

    Draft paper submission deadline

  • Jun 10 2019

    Registration deadline

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