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1742
A Gating Path Optimization Method for Press-Pack IGBTFinal Paper

Huaidong Min*

Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials

1473
Design of an Inductor-Integrated Transformer Applied to Inverter Power SupplyFinal Paper

Xinsheng Zhang*

Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials

117
A New Screening Method for Alleviating Transient Current Imbalance of Paralleled SiC MOSFETsFinal Paper

Yizhe Liu, Xiaoping Dai, Xi Jiang*, Fang Qi, Yang Liu, Pan Ke, Yongzhi Wang, Jun Wang, Zhong Zeng

Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials

111
Comparative Analysis of CM EMI for Boost Converter Using Si/SiC hybrid switchFinal Paper

Bo Hu, Zishun Peng, Pei Xiao, Yuxing Dai, Chao Zhang, Jun Wang*

Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials

101
A Hybrid Si/GaN 5-Level Flying Capacitor Single-phase Inverter and its Current Ripple AnalysisFinal Paper

Chao Zhang*, Kun Qu, Xin Yin, Jun Wang, Weibin Chen, Bo Hu

Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials

97
A CM EMI Suppression Strategy for the Single-Phase inverter based on the Si/SiC Hybrid SwitchFinal Paper

Shuaige Zhu, Haiyan Zhu, Qihui Fu, Yuxing Dai, Jun Wang*, Ling Ou, Pei Xiao, Zishun Peng

Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials

2
A Novel Active Gate Driver with Auxiliary Gate Current Control Circuit for Improving Switching Performance of High-Power SiC MOSFET ModulesFinal Paper

Chengfei Geng, Donglai Zhang*, Xuanqin Wu, Wen Shen, Ruiyong Dong

Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials

    7 Records 1/1
Important Date

  • Conference Date

    Nov 02

    2020

    to

    Nov 04

    2020

  • Oct 27 2020

    Draft paper submission deadline

  • Nov 03 2020

    Contribution Submission Deadline

  • Nov 04 2020

    Registration deadline

  • Nov 17 2020

    Final Paper Deadline

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IEEE IAS Student Chapter of Huazhong University of Science and Technology (HUST)
Organized By
Huazhong University of Science and Technology
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