Introduction

The ISSE conference series is a renowned European forum for exchanging knowledge between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and micro/nanoelectronics technology and in particular electronics packaging technology. The motto of the upcoming conference event is "Advancements in Microelectronics Packaging for Harsh Environment". In the frame of a unique combination of poster exhibitions, oral paper presentations, and individual meetings senior and junior researchers from all over the world come together to discuss scientific problems and their teaching experiences as well as plan and organize international research co-operations and student exchanges in a convenient and multicultural atmosphere.

Committee

General Chair    

Heinz Wohlrabe (TU Dresden, Germany)

Secretary of ISSE    

Oliver  Krammer (Budapest University of Technology and Economics, Hungary)

Technical Program Chair    

Johann Nicolics (Vienna University of Technology, Austria)

Conference Chair    

Heinz Wohlrabe (TU Dresden, Germany)
 

Call for paper

Important date

2021-02-05
Abstract submission deadline
2021-04-16
Draft paper submission deadline

Submission Topics

Topics of Interest:

New Materials, Components and Processes
Thermal Management
Advanced Packag ing and Interconnection Technologies
Testing, Relability and Quality Management
Process Modelling and Simulation
Environmental and Ecological Efects in Electronics Technology
Nanotechnology, Nanomaterials and Nanoelectronics
Signal Integrity and Electromagnetic Compatibility
Sensors, Actuators and Microsystems
Educational and Information Technologies in Electronics Manufacturing
Discrete and Integrated Components
 

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Important Date
  • Conference Date

    May 05

    2021

    to

    May 09

    2021

  • Feb 05 2021

    Abstract Submission Deadline

  • Apr 16 2021

    Draft paper submission deadline

  • May 09 2021

    Registration deadline

Sponsored By
Dresden University of Technology IEEE Electronics Packaging Society