Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry’s leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August in the center of the world’s capital of electronics activity, Silicon Valley.
The HOT CHIPS conference typically attracts more than 500 attendees from all over the world. It provides an opportunity for chip designers, computer architects, system engineers, press and analysts, as well as attendees from national laboratories and academia to mix, mingle and see presentations on the latest technologies and products. The three days of the conference typically feature two tutorials, two keynotes, a panel discussion and around 25 presentations on a variety of subjects related to microprocessors and integrated circuits. It is widely covered by the media; last year, we had about 25 members of the industry and national press covering the conference.
Sponsor Type:1
General-Purpose Processor Chips
Domain-Specific Chips
Reconfigurable Chips
Security
Mobile and Embedded Devices
Communications and Networking
Emerging Computing Architectures
Memory Technologies
Other Enabling Technologies
Software and Systems for Emerging Hardware
Aug 22
2021
Aug 24
2021
Draft paper submission deadline
Draft Paper Acceptance Notification
Registration deadline
2018-08-19 United States
2018 IEEE Hot Chips 30 Symposium2017-08-19 United States Cupertino
2017 IEEE Hot Chips 29 Symposium2016-08-21 United States Cupertino,USA
2016 IEEE Hot Chips 28 Symposium2013-08-25 United States
2013 IEEE Hot Chips 25 Symposium
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