Introduction

You are cordially invited to participate in and attend the Computing, Communications and IoT Applications Conference (ComComAp 2021) to be held in Shenzhen, China, on November 26-28, 2021. The conference is to address, explore and exchange information on the state-of-the-art in all types of computing systems, communications, and networking as well as IoT/Engineering applications.

We are interested in visionary, experimental, systems-related and work in-progress papers on the current state of research in Computers, Communications/Networking and IoT/Engineering Applications and related issues. Papers should describe original, previously unpublished work, not currently under review by another conference, workshop, or journal.

Sponsor Type:3; 5; 9

Call for paper

Important date

2021-10-15
Draft paper acceptance notification

Submission Topics

Topics include (but not limited to):

  • Antenna & Microwave/MM-Wave/ Devices/Circuits.

  •  Internet of Things (IoT) Services & Applications

  • Wireless Communications, Smart Syatems, Cloud/Fog & Big Data

  • Wieless Networks & Network Security

Guidlines

Please submit an electronic copy of your original full manuscript (not to exceed 6 double-column IEEE formatted pages, including figures, tables, and references) to: https://edas.info/XXXXX (Soon)

Accepted and presented technical papers will be submitted to IEEE Xplore and Compendex. In addition, high quality papers will be invited to be submitted to one of 5 Journal Special Issues:

1)  International Journal of Antennas and Propagation Journal

2)  International Journal of Information Technology, Communications and Convergence Journal

3)  Peer to Peer Networking & Applications Journal

4)  Journal of Network and Computer Applications Journal

5)  International Journal of Distributed Sensor Networks Journal

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Important Date

  • Conference Date

    Nov 26

    2021

    to

    Nov 28

    2021

  • Oct 15 2021

    Draft Paper Acceptance Notification

  • Nov 28 2021

    Registration deadline

Sponsored By
Southern University of Science and Technology, Shenzhen, China
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